Insights
Analysis and commentary on markets, companies, and the forces that move them.
Company & ETF Analysis
GPUs, HBM, and the Bridge Between Them: Mapping the Advanced Packaging Chokepoint
Why advanced packaging — the process that fuses GPU dies to their HBM stacks — may be the tightest and least discussed constraint in the entire AI hardware supply chain.
Company & ETF Analysis
Why HBM May Decide the Next Decade of AI Chips More Than the GPU Does
Why high-bandwidth memory, not the GPU itself, has become the binding constraint on AI hardware supply — and what would actually have to change for that to shift.
Company & ETF Analysis
NVIDIA, TSMC, SK Hynix, and Samsung: Mapping the True Center of Gravity in the AI Semiconductor Race
A structural map of the four companies that anchor the AI hardware buildout — NVIDIA, TSMC, SK Hynix, and Samsung — and the physical bottlenecks that actually gate AI chip supply.